Micro Automation M-1006A Bench Top Programmable Dicing Saw Model 1006
Spindle (shaft) included w/o blade It is used for dicing wafers used in semiconductor manufacture. Capable of dicing up to 150 mm dia. wafers. Air bearing spindle with an adjustable speed from 10,000 to 40,000 rpm. Unit is tested mechanically, electrically, and pneumatically. No vacuum tests performed. Power Requirement: 120V, 50/60 Hz.