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Micro Automation Inc. M-1006A Bench Top Programmable Dicing Saw Model 1006

$5,000.00
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SKU:
35748
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Used
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Micro Automation Inc. M-1006A  Bench Top Programmable Dicing Saw Model 1006

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Micro Automation M-1006A Bench Top Programmable Dicing Saw Model 1006
  • Spindle (shaft) included w/o blade
  • It is used for dicing wafers used in semiconductor manufacture.
  • Capable of dicing up to 150 mm dia. wafers.
  • Air bearing spindle with an adjustable speed from 10,000 to 40,000 rpm.
  • Unit is tested mechanically, electrically, and pneumatically. No vacuum tests performed.
  • Power Requirement: 120V, 50/60 Hz.
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