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Micro Automation Inc. M-1006A Bench Top Programmable Dicing Saw Model 1006

Micro Automation Inc. M-1006A Bench Top Programmable Dicing Saw Model 1006
SKU: 35748
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$5,000.00
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Details

Micro Automation M-1006A Bench Top Programmable Dicing Saw Model 1006
  • Spindle (shaft) included w/o blade
  • It is used for dicing wafers used in semiconductor manufacture.
  • Capable of dicing up to 150 mm dia. wafers.
  • Air bearing spindle with an adjustable speed from 10,000 to 40,000 rpm.
  • Unit is tested mechanically, electrically, and pneumatically. No vacuum tests performed.
  • Power Requirement: 120V, 50/60 Hz.
  • Additional Info
    Brand Micro Automation Inc.
    MPN M-1006A
    Model N/A
    Product Name Bench Top Programmable Dicing Saw Model 1006
    Condition Used
    Condition Description This item has been inspected and appears to be in good condition
    Weight 275.0000
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