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Micro Automation 1100 Programable Dicing Saw

Micro Automation 1100 Programable Dicing Saw
SKU: 16184
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Micro Automation 1100 Programmable Dicing Saw.
  • Microprocessor-controlled, programmable, automatic saw for cutting semiconductor wafers and other hard material. Wafer Dimensions - Round: Dia.: Max.: 6 in. Min.: 2 in.
  • Rectangular: Sides Max.: 6 in.
  • Wafer Thickness: Max.: 500 mils. Min.: 1 mil.
  • Spindle Speeds: 15,000 - 40,000 RPM.
  • Program Storage Capacity: 60 standard programs.
  • Uses split screen monitor and video system to align wafers
  • This unit powers up, but needs repair contact our tech. Dept. for more Info. (Al, x205)
  • Additional Info
    Brand Micro Automation
    MPN 1100
    Model N/A
    Product Name Programable Dicing Saw
    Condition AS-IS
    Condition Description This item is being sold in As-Is condition and includes many useful parts. Please review description and photos and contact us with any questions.
    Weight 468.0000
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