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Micro Automation 1100 Programable Dicing Saw

$4,000.00
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SKU:
16184
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Used
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Micro Automation 1100  Programable Dicing Saw

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Micro Automation 1100 Programmable Dicing Saw.
  • Microprocessor-controlled, programmable, automatic saw for cutting semiconductor wafers and other hard material. Wafer Dimensions - Round: Dia.: Max.: 6 in. Min.: 2 in.
  • Rectangular: Sides Max.: 6 in.
  • Wafer Thickness: Max.: 500 mils. Min.: 1 mil.
  • Spindle Speeds: 15,000 - 40,000 RPM.
  • Program Storage Capacity: 60 standard programs.
  • Uses split screen monitor and video system to align wafers
  • This unit powers up, but needs repair contact our tech. Dept. for more Info. (Al, x205)
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