Micro Automation 1100 Programmable Dicing Saw.
Microprocessor-controlled, programmable, automatic saw for cutting semiconductor wafers and other hard material. Wafer Dimensions - Round: Dia.: Max.: 6 in. Min.: 2 in. Rectangular: Sides Max.: 6 in. Wafer Thickness: Max.: 500 mils. Min.: 1 mil. Spindle Speeds: 15,000 - 40,000 RPM. Program Storage Capacity: 60 standard programs. Uses split screen monitor and video system to align wafers This unit powers up, but needs repair contact our tech. Dept. for more Info. (Al, x205)