The Semiconductor Equipment Corporation (SEC) Model 4150 Flip Chip Die Bonder combines S.E.C.'s expertise in die bonding and reflow soldering with a precision alignment system to provide a versitile process development tool or low volume production system for multi chip module projects and other flip chip applications.
Complete w/Manuals,13 Sony PVM 1343-MD terminal & the following features: Video alignment system with a cube beam splitter, color camera with motorized zoom lens, super fine pitch color monitor, & 2 independent high intensity fiber optic illuminators. Viewer is motorized in X & Y for close up scanning of alignment. Electronic joystick with precision control. Motorized Z motion pick-up head with closed loop electronic bond load control. Manually traversing table with locks for positioning pick-up tray or bonding stage under head. Manually Positioned Die Tray Holder with 4 waffle pack capicity. Heated work stage with 4x4 flat vacuum chuck and closed loop temperature control to 350 degrees C. Motorized X,Y and theta movement for workstage with 2 inches of X & Y travel. Electronic Joystick Control. Heated flat face vacuum pick-up tool with closed loop temperature control to 250 degrees C. Cover gas over heated stage with panel mounted flow control. Cycle for rework or removal of die.
Serial # 4150-1009
This item was deinstalled from a working environment and appears to be in good condition. This item is used and shows signs of normal wear with minior scuffs and scrapes.