Drytek DRIE-100 Cassette Planar Plasma Wafer Etcher System w/Manuals
Uses chlorine- and fluorine-based chemistries for etching various Si, polysilicon, nitride, tungsten, tungsten silicide films.+ Low energy etching for minimal substrate damage. Excellent selectivity, e.g., 20:1 poly Si:SiO2 Laser interferometer for etch rate determination and end-point detection. Leybold-Heraeus D60A Trivac Rotary Vane Vacuum Pump w/Breaker Box available for unit Various Accessories & Wafer Holders Included Complete Manuals Included
Condition: For Parts or Not Working
This Drytek plasma wafer etching system came from a R&D application for superconductor cellular tower switching manufacturer. Because of its age and lack of recent use we are selling it in AS-IS condition. Please view our photo set and contact us if you have any questions.
